UTP-8 Thermal Putty,Cooling Pad for Electronic Devices (10, Grams)
- NOT SUITABLE FOR CPU: 14.8 W/mK high‐conductivity thermal putty, works as replacement for soft thermal pads, fills gaps for GPU, VGA and memory IC chips.
- NON‐CONDUCTIVE & SAFE: Halogen‐free and RoHS compliant formula prevents short‐circuit risk, delivers stable performance under high‐temperature working conditions.
- LOW VISCOSITY & MOLDABLE: Tacky flexible texture fits uneven surfaces. Supports auto‐dispensing equipment and stencil screen‐printing application scenarios.
- NO DRY‐OUT PERFORMANCE: Fully cured thermal material will not dry out over time, great for electronic assembly, rework and field repair projects.
- GAP‐FILLING COST‐SAVER: Compresses well to fill gaps compared with rigid thermal pads, practical for PC modders and electronics maintenance technicians.
Estimated shipping
Select a product to estimate shipping.UTP‐8 Moldable Thermal Putty is RoHS compliant halogen‐free gap‐filling thermal material, NOT intended for CPU use. 14.8W/mK thermal performance replaces traditional thermal pads for GPU, VGA and memory IC chips. Low‐viscosity tacky texture supports manual or auto‐dispensing installation. It will not dry out, ideal for electronic assembly, rework and field repair.
Especificaciones
| Main Specification | |
|---|---|
| Fabricantes | UPSIREN |
| Marca | UPSIREN |
| Número de artículos | 1 |
| Peso del artículo | 10 g |
| Product information | |
|---|---|
| Dimensiones del paquete | 10 g, 11 x 9.3 x 2.31 cm |
| Número del modelo de artículo | UTP-8 |
| Baterías necesarias | No |
| Technical Details | |
|---|---|
| Modelo | UTP-8 |
| País de origen | USA |
| Otros | |
|---|---|
| Tipo de producto | Pads termales |
| Fecha Primera Disponible | 14 May 2026 |
| Baterías incluidas | No |
| Etiquetas | |
|---|---|
| Etiquetas | |