Sn99/Ag0.3/Cu0.7 Solder Paste, 5ML Syringe No-Clean Lead-Free Soldering Paste, 217°C Melting Point High-Temperature Solder Paste,Solder Paste for Electronics
- Composition of Solder Paste: Sn: 99% / Ag: 0.3% / Cu: 0.7%, Sloder Flux Content: 11.2%.
- Lead-Free Solder Paste Gross Weight: 0.57 oz / 16 g (Syringe).
- High-Temperature Soldering Paste, Melting Point: 217°C (423°F).
- Syringe Solder Paste Flux Properties: Lead-Free / Smooth & Even Solder Joints / No Solder Balls or Bridging After Reflow.
- Solder Pasteing Applications: Welding of Heat Sink Modules & LED Soldering & High-Frequency Soldering & PCB BGA CPU SMD SMT Electronic Device Rework Tools.
- Warranty: If You Have Any Questions, Please Feel Free to Contact Us at Any Time. Thank You.
Estimated shipping
Select a product to estimate shipping.Global Exhibitions & Industry Engagement
We actively participate in global electronics and soldering industry exhibitions, connecting with customers from different countries and continuously improving our product performance and manufacturing standards.
Our presence at international trade shows demonstrates our commitment to innovation, quality, and long-term partnership with global clients.
Quality Control & Product Safety Management
Our products comply with international quality and safety standards, including ISO management systems and MSDS material safety documentation.
We ensure strict raw material control, stable chemical formulation, and full compliance for global transportation and industrial use.
217°C High-Temperature Lead-Free Solder Paste
Our 217°C lead-free solder paste is engineered for high-reliability electronic assembly, delivering stable solder joints, excellent printability, and consistent reflow performance.
With optimized melting behavior and strong wetting capability, it ensures reliable connections for PCB surface mount assembly and automated production processes.
Suitable for precision electronics manufacturing, SMT assembly, and industrial soldering applications requiring stable high-temperature performance.
Solder Paste Product information:
Product details
Especificacions
| Main Specification | |
|---|---|
| Components inclosos | Needles*3, Push Rod*1, Solder Paste*1 |
| Fabricant | KELLYSHUN |
| Marca | KELLYSHUN |
| Quantitat de paquets d' element | 1 |
| Font d' energia | mà reduït |
| Dimensions del producte | 5 x 1 x 1 inches |
| Material | Estany |
| Estil | 1 Pack-5CC |
| Pes de l' element | unces 0, 75 |
| Product information | |
|---|---|
| Número de model d' element | TH-1551 5ML-1 Pack |
| Altres | |
|---|---|
| Data Primer disponible | 2025, gener 31 |
| Tipus de producte | Venut |
| Etiquetes | |
|---|---|
| Etiquetes | |